Molex 2.4/5-GHz and 900-MHz ultra-thin Ceramic and LDS/MID Antennas
Internet of Things (IoT) Antennas: Wi-Fi, Bluetooth, Zigbee
2.4/5-GHz and 900-MHz ultra-thin Ceramic and LDS/MID antennas from Molex offer cabled, flex and PCB formats to enable fast and easy RF integration into connected systems and are ideal for embedding high-performing internet and data connectivity in compact devices.
Compact, efficient, high-gain antennas, combined with massive expansions of wireless and data networks, have changed the ways that devices are designed and developed. The external antenna has given way to PCB and internally cabled antennas in practically all of today’s connected devices. In response, Molex Antenna Products provide many choices to designers of wireless-enabled devices that support one or more protocols, including Bluetooth, Wi-Fi, Zigbee and WLAN. Molex also offers antennas in various form factors, such as SMD mounting, internally cabled PCB antennas as well as cabled internal adhesive antennas. They support maximum radiation efficiencies over a wide range of wireless applications, delivering unmatched performance.
Molex PCB antennas are ideal for modern pick-and-place manufacturing technologies. To facilitate the most optimal design of PCB antennas, Molex has published application specifications that provide easy-to-understand antenna design guidelines.
For applications where an internally cabled antenna is preferred, Molex offers two types: one fabricated from a PCB and the other with a flexible, adhesive-backed surface for convenient mounting inside the device. Furthermore, cable length options of 50.00 to 300.00mm provide extended connectivity and balanced transmission throughout, from antenna to UFL connector. Application specifications are also published for Molex cabled antennas.
Molex 2.4/5-GHz and 900-MHz ultra-thin Ceramic and LDS/MID Antennas Features and Benefits:
- Poly-flexible, double-sided adhesive tape on antenna
Enables easy peel-and-stick mounting anywhere within the device casin
- High antenna radiation performance
Total efficiency values of 80% minimum (2.4 GHz band) and 70% minimum (5 GHz band)
- Ground plane independent design
Reduces engineering resources and costs needed to mitigate PCB ground-induced radiation
- Triple-band ceramic antennas enable multi-vendor operability
Offers greater power efficiency and long-range connectivity to Wi-Fi-certified products
- Laser direct structuring (LDS) chip antenna technology
Ensures consistent antenna RF performance due to excellent laser structuring repeatability, precision and accuracy
- SMT ceramic antennas integrate quickly and easily on center of PCB edge
Provides optimum performance
- Compact rigid PCB antenna
Combines greater space savings with secure mounting to the device’s chassis
- Wide selection of micro-coaxial cable lengths from 50.00 to 300.00mm
Extends connectivity for maximum design flexibility
- Pick-and-place optimized
Delivers fast and flawless assembly
Designed and packaged for easy integration into modern pick-and-place manufacturing lines
- Miniature on-ground molded interconnect device (MID) chip antenna with small footprint and small clearance zone
Provides PCB real estate savings on mounted side of the antenna
- SMT ceramic antennas offer symmetrical radiator design
Delivers design flexibility by allowing reversed lateral placement on PCB without affecting radiation pattern or performance
Molex 2.4/5-GHz and 900-MHz ultra-thin Ceramic and LDS/MID Antennas Applications:
Click here to download the datasheets and application brief from Molex:
For price and availability, please visit the Molex catalog on Sager.com.
Visit the Molex page on www.sager.com for more information or contact a Sager sales representative, the authorized Distributor for Molex, at 1.800.SAGER.800 or firstname.lastname@example.org.